Economy

US announces $1.4 billion support for next-generation semiconductor advanced packaging

By
1 Mins read
3
0
Share

(Reuters) – The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.

This post appeared first on investing.com

3
0
Share
Related posts
Economy

Nasdaq futures lead gains after Netflix results, Trump’s AI investment plans

By
2 Mins read
(Reuters) – U.S. stock index futures rose on Wednesday, with those tied to the tech-heavy Nasdaq in the lead as investors cheered…
Economy

Texas economy growth moderates but remains strong: Wells Fargo

By
1 Mins read
Wells Fargo (NYSE:WFC) economists noted that the Texas economy, while cooling from its post-pandemic surge, continues to outpace the national average in…
Economy

15 Chinese provinces revise 2025 GDP growth targets

By
1 Mins read
Investing.com — Fifteen provinces in China have revised their GDP growth targets for 2025, with most setting their aim between 5% and…

    Sign up for our newsletter to receive the latest insights, updates, and exclusive content straight to your inbox! Whether it's industry news, expert advice, or inspiring stories, we bring you valuable information that you won't find anywhere else. Stay connected with us!

    By opting in you agree to receive emails from us and our affiliates. Your information is secure and your privacy is protected.